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ComoNetwork

CMP抛光垫 | 突破美日垄断,发泡技术及材料赋能“中国芯”!

化学机械抛光(MPC)目前世界上唯一能兼顾表面全局和局部平坦化的技术,使芯片制造商能够继续缩小电路面积并扩展光刻工具的性能。每个晶圆的生产,都需要对晶片进行多次CMP抛光才得以实现——最多需要反复128次。
Wednesday 11 May 2022

0.7497173

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